SI/EMC/Thermal

Pre-route and Post-route SI Analysis

SI analysis to meet the design specifications in respect of timing, skew, crosstalk and signal distortions. Pantech Solutions combines SI tools and design expertise, coupled with constraint managed design paradigm, in order to address complex engineering tasks. This ensures "First Time Right Designs" and reduces time to market.

EMI/EMC Analysis

EMI/EMC analysis permits the prediction of EMI/EMC behaviors already in the design phase of product design. Critical issues can be identified and corrected already on board level.At Pantech Solutions analyses and optimizes layouts in order to target EMC compatibility and thus reduce time to market. Near field (Magnetic) and Far Field (Electric) radiations are simulated and reports are generated for analysis purposes.

Thermal Analysis

• Thermal Analysis of temparature critical designs as for example automotive designs and power electronics.
• Detailed reports indicating component and board temperature profiles.
• Heat sink and cooling proposals.
• Metal core and themal ladder PCB designs.
• System level thermal analysis.